Organosolv Lignin for Non-Isocyanate Based Polyurethanes (NIPU) as Wood Adhesive

A non-isocyanate-based polyurethane (NIPU) wood adhesive was produced from organosolv lignin, which is a bio-sourced raw material, available in large quantities and as by-product of the paper industry. The formulation this new lignin-based NIPU adhesive, presented, chemically characterised by Matrix-Assisted Laser Desorption Ionization Time Flight (MALDI ToF) mass spectrometry Fourier Transform Infra-Red (FTIR) analyses. oligomers formed were determined showed that three species involved preparation co-reaction reagents used: dimethyl carbonate, hexamethylene diamine. Linear branched structures both identified. Mechanical properties using Automated Bonding Evaluation System (ABES) internal bond (IB) strength test laboratory particleboard bonded with it. has shown satisfactory mechanical after hot pressing at 230°C. Such temperature used industrially most modern factories, but since it hardly feasible for more conventional bonding equipment, reactivity successfully increased addition small percentage silane coupling agent. With silane, proposed could also be hot-pressing lower than 200°C.